Kinetics of contact formation between dissimilar crystalline materials during the period of active strain of the first stage of a solid-phase topochemical reaction

https://doi.org/10.58224/2618-7183-2025-8-6-7
One of the key processes that largely determines the quality of a permanent precision joint formed in the solid state under pressure and heat, which belongs to the class of solid-state topochemical reactions and proceeds in three main stages, is the formation of actual contact, which transitions to a state of physical contact (stage one) at a certain ratio of the level of thermal strain and the contact area. The latter is formed due to plastic strain and the shape change of microprotrusions on the surfaces being joined, which alters the mechanical properties of the resulting contact pads and the near-contact volume of the metal microprotrusions. To develop valid process parameters for producing a high-quality joint, it is important to establish the influence of temperature, pressure, and the height of microroughness of the contacting surfaces of the materials being joined on the kinetics of individual stages of the solid-state topochemical reaction under thermal strain. This paper presents the kinetic dependencies of contact formation during the period of active strain or active loading between dissimilar crystalline materials using the example of synthetic single-crystal corundum – MB copper (oxygen-free) and provides their physical and mathematical justification. Knowledge of the kinetic laws governing the formation of actual contact and the transition to physical contact at a certain ratio of the level of thermal strain action and stress state (the ratio of normal and tangential microstresses of the 2nd kind on the surface of contact pads and in the volume of microprotrusions) and the occurring mechano-physical-chemical processes on the surface of the forming contact pads and in the volume of microprotrusions, allows for a more rational consideration, construction and implementation of the technological process for obtaining a precision detachable (contact of the traction sheave with the cable) or permanent connection of materials in a wide variety of combinations, including those with different nature of chemical bonds and resistance to plastic strain, and will also allow for the consideration and assessment of the role of microstresses of the 2nd kind in the occurrence and propagation of microcracks in the grain of the metal and the provision of recommendations for the prevention of sudden brittle failure of welded building metal structures.
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1. Arzumanyan A.M., Mirvelyan T.A. Features of crystallography and physical-mechanical properties of synthetic corundum. NAU. 2015. 4-2 (9).
2. Nadolny K. State of the art in production, properties and applications of the microcrystalline sintered corundum abrasive grains. Int J Adv Manuf Technol. 2014. 74. P. 1445 – 1457.
3. Tevyashev A.D., Suzdal V.S., Borodavko Yu.M., Pelipets A.A. Mathematical models of physical processes in growing single crystals by the Czochralski method. Radioelectronics and Information Technology. 2001. 4 (17).
4. Rykalin N.N., Shoroshorov M.Kh., Krasulin Yu.L. Physical and chemical problems of joining dissimilar materials. Izvestiya AN SSSR. Ser. Inorganic Materials. 1965. 1 (1). P. 62 – 70.
5. Krasulin Yu.L., Shorshorov M.Kh. On the mechanism of formation of a compound of dissimilar materials in the solid state. Physics and Chemistry of Мaterials Рrocessing. 1967. 1. P. 15 – 18.
6. Barre P. Kinetics of heterogeneous processes. M. Mir, 1976. 399 p.
7. Kronberg M.I. Dynamical Flow Properties of Single Crystals of Sapphire, I. Journal of the American Ceramic Society.2006. 45 (6). P. 274 – 279. DOI: 10.1111/j.1151-2916.1962.tb11143.x
8. A.s. No. 400488 USSR. Method of sealing sapphire windows. Urusov N.V., Babashov I.V., Bondarenko I.V., Abramov V.V., Sudenkov E.G. Cl. 24.05. 1971. published 01.10.1971. Bulletin No 40.
9. Ruby and Sapphire. Edited by M.V. Klassen-Neklyudova and H.S. Bagdasarov. M. Nauka. 1974. 379 p.
10. Abramov V.V. Evaluation of microprotrusion shape change and contact development between dissimilar crystalline materials under thermal strain impact. Izvestiya Tula State University. 2025. 2. Р. 502 – 517.
11. Abramov V.V., Bychkov N.S., Gustov D.Yu.Kinetics of setting between dissimilar crystalline materials under thermo deformation effect. E3S Web of Conferences. 2023. 402. 11015. DOI: 10.1051/e3sconf/202340211015
12. Kulikov A.D., Petrov P.A., Demetrashvili I.S., Burlakov I.A., Khanh Toan Nguyen Evolution of the microstructure of copper M1 during plastic strain. Light alloy technology. 2024. 4. DOI: 10.24412/0321-4664-2024-4-38-44
13. Abramov V.V., Rakunov Yu.P., Bychkov N.S. Some features of the kinetics of contact interaction between dissimilar materials under thermal strain effects. Engineering journal. Handbook. 2025. 4. P. 74 – 87.
14. Abramov V.V., Rakunov Yu.P., Zheglova Yu.G. The role of microstresses of the second kind in the mechanical-physical-chemical processes of setting of dissimilar crystalline materials under thermal strain effects. Engineering journal. Handbook. 2025. 5. P. 63 – 78.
15. Komkov V. G., Zhivetyev A. S. Influence of alloying and temperature regimes of copper melting on the structure and mechanical properties. Scientific notes of Pacific National University. 2013. 4.
16. Abramov V.V. Kinetics of combined processes of smoothing and pressure welding with heating of dissimilar crystalline materials with greatly varying resistance to plastic strain. Physics and Chemistry of Мaterials Рrocessing. Academy of Sciences of the Russian Federation. 2024. P. 65 – 76.
Abramov V.V., ZheglovaYu.G. Kinetics of contact formation between dissimilar crystalline materials during the period of active strain of the first stage of a solid-phase topochemical reaction. Construction Materials and Products. 2025. 8 (6). 7.
https://doi.org/10.58224/2618-7183-2025-8-6-7